By Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)
This ebook discusses the clinical mechanism of copper electrodeposition and it truly is wide selection of functions. The ebook will hide every little thing from the fundamental basics to sensible purposes. moreover, the ebook also will hide very important subject matters such as:
• ULSI wiring fabric established upon copper nanowiring
• published circuit forums
• Stacked semiconductors
• via Silicon through
• gentle copper foil for Lithium-Ion battery electrodes
This publication is perfect for nanotechnologists, pros, and practitioners.
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Additional info for Copper Electrodeposition for Nanofabrication of Electronics Devices
As already described above in Fig. 15, the authors confirmed CuCl precipitation on copper surface by detecting the change in reaction intermediates concentration, Cu+ or CuCl2-, with changing Clconcentration in the plating bath of various Cu2+ concentrations using RRDE. 2 M Cu2+ concentrations, respectively. Considering the high concentration of the plating bath, those critical Cl- concentrations would be reasonable. As shown in Fig. 4 of the preceding section, Cu+ concentration on copper surface changes depending on the electrode potential obeying the Nernst equation in the Cu plating bath.
A Hull-Cell is a trapezoidal cell in which a diagonal cathode substrate is placed opposite the anode as shown in Fig. 1. Plating conditions and addition agents used in the Hull-Cell experiments are noted in this figure. Fig. 1 Hull Cell for visual evaluation of copper plating over the wide range of deposition current. Cell volume; 267 mL, Temp; 30 °C, Electric quantity; 2A 9 8 min. 4MCuSO4 ? 2 shows the changes in Hull Cell patterns of copper plating with POE/ POP (P) and JGB (J), in the presence of S and Cl- with constant concentrations.
We begin with a consideration of the homogeneous solution chemistry of SPS and MPS and their interactions with other components of the bath. These interactions include transformations of the molecules into the effective accelerant as well as their degradation and deactivation. We then turn to their adsorption on copper and to the effect of applied potential on their surface chemistry. Finally, we consider the models that have been proposed to describe the role played by accelerants in the filling of features on various spatial and temporal scales.